Bart Vandevelde: search on Z-Library

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1

Package and solder joint reliability analysed by FEM simulation and experiments

Bart Vandevelde, Dag Andersson

Journal:

Microelectronics Reliability

Year:

2004

Language:

english

File:

PDF, 212 KB

english, 2004

2

Automatic Power-Sharing Modification of $P$/$V$ Droop Controllers in Low-Voltage Resistive Microgrids

Vandoorn, Tine L., De Kooning, Jeroen D. M., Meersman, Bart, Guerrero, Josep M., Vandevelde, Lieven

Journal:

IEEE Transactions on Power Delivery

Year:

2012

Language:

english

File:

PDF, 1.49 MB

english, 2012

3

Design of metal interconnects for stretchable electronic circuits

Mario Gonzalez, Fabrice Axisa, Mathieu Vanden Bulcke, Dominique Brosteaux, Bart Vandevelde, Jan Vanfleteren

Journal:

Microelectronics Reliability

Year:

2008

Language:

english

File:

PDF, 2.55 MB

english, 2008

4

Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly

Nele Van Steenberge, Paresh Limaye, Geert Willems, Bart Vandevelde, Inge Schildermans

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.29 MB

english, 2007

5

Parameterized Modeling of Thermomechanical Reliability for CSP Assemblies

Vandevelde, Bart, Beyne, Eric, Zhang, Kouchi (G.Q.), Caers, Jo, Vandepitte, Dirk, Baelmans, Martine

Journal:

Journal of Electronic Packaging

Year:

2003

Language:

english

File:

PDF, 1.11 MB

english, 2003

6

Thermal cycling reliability of SnAgCu and SnPb solder joints: A comparison for several IC-packages

Bart Vandevelde, Mario Gonzalez, Paresh Limaye, Petar Ratchev, Eric Beyne

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 1.03 MB

english, 2007

7

Analytical Thermo-Mechanical Model for Non-Underfilled Area Array Flip Chip Assemblies

Vandevelde, Bart, Beyne, Eric, Vandepitte, Dirk, Baelmans, Martine

Journal:

Journal of Electronic Packaging

Year:

2004

Language:

english

File:

PDF, 424 KB

english, 2004

8

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Werkhoven, Daniel, Vanderstraeten, Daniel, Blansaer, Eddy, Lannoo, Jonas, Pissoort, Davy

Year:

2019

Language:

english

File:

PDF, 796 KB

english, 2019

9

[IEEE 2010 IEEE Custom Integrated Circuits Conference -CICC 2010 - San Jose, CA, USA (2010.09.19-2010.09.22)] IEEE Custom Integrated Circuits Conference 2010 - Verifying electrical/thermal/thermo-mechanical behavior of a 3D stack - Challenges and solutions

Van der Plas, Geert, Thijs, Steven, Linten, Dimitri, Katti, Guruprasad, Limaye, Paresh, Mercha, Abdelkarim, Stucchi, Michele, Oprins, Herman, Vandevelde, Bart, Minas, Nikolas, Cupac, Miro, Dehan, Mori

Year:

2010

Language:

english

File:

PDF, 877 KB

english, 2010

10

Impact of speed ripple on the back-emf waveform of permanent magnet synchronous machines

Vandevelde, Lieven, De Kooning, Jeroen D. M., Vandoorn, Tine L., Meersman, Bart, Van de Vyver, Jan

Journal:

IET Electric Power Applications

Year:

2013

Language:

english

File:

PDF, 751 KB

english, 2013

11

Voltage-Based Droop Control of Renewables to Avoid On–Off Oscillations Caused by Overvoltages

Vandoorn, Tine L., De Kooning, Jeroen, Meersman, Bart, Vandevelde, Lieven

Journal:

IEEE Transactions on Power Delivery

Year:

2013

Language:

english

File:

PDF, 1.14 MB

english, 2013

12

Dc-bus voltage balancing controllers for split dc-link four-wire inverters and their impact on the quality of the injected currents

Bozalakov, Dimitar, Meersman, Bart, Bottenberg, Agknaton, Rens, Johan, Desmet, Jan, Vandevelde, Lieven

Journal:

CIRED - Open Access Proceedings Journal

Year:

2017

Language:

english

File:

PDF, 446 KB

english, 2017

13

Design and implementation of flexible and stretchable systems

Mario Gonzalez, Bart Vandevelde, Wim Christiaens, Yung-Yu Hsu, François Iker, Frederick Bossuyt, Jan Vanfleteren, Olaf van der Sluis, P.H.M. Timmermans

Journal:

Microelectronics Reliability

Year:

2011

Language:

english

File:

PDF, 2.45 MB

english, 2011

14

[IEEE 2014 15th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Belgium (2014.04.7-2014.04.9)] 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hidden Head-In-Pillow soldering failures

Vandevelde, Bart, Willems, Geert, Allaert, Bart

Year:

2014

Language:

english

File:

PDF, 2.16 MB

english, 2014

15

[IEEE 2010 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM 2010) - Pisa, Italy (2010.06.14-2010.06.16)] SPEEDAM 2010 - Power balancing in islanded microgrids by using a dc-bus voltage reference

Vando, Tine L., Renders, Bert, Degroote, Lieven, Meersman, Bart, Vandevelde, Lieven

Year:

2010

Language:

english

File:

PDF, 244 KB

english, 2010

16

[IEEE 2011 IEEE Second International Conference on Smart Grid Communications (SmartGridComm) - Brussels, Belgium (2011.10.17-2011.10.20)] 2011 IEEE International Conference on Smart Grid Communications (SmartGridComm) - Assessment and mitigation of voltage violations by solar panels in a residential distribution grid

Verschueren, Tom, Mets, Kevin, Meersman, Bart, Strobbe, Matthias, Develder, Chris, Vandevelde, Lieven

Year:

2011

Language:

english

File:

PDF, 571 KB

english, 2011

17

Impact of the electrodeposition chemistry used for TSV filling on the microstructural and thermo-mechanical response of Cu

Chukwudi Okoro, Riet Labie, Kris Vanstreels, Alexis Franquet, Mario Gonzalez, Bart Vandevelde, Eric Beyne, Dirk Vandepitte, Bert Verlinden

Journal:

Journal of Materials Science

Year:

2011

Language:

english

File:

PDF, 1.55 MB

english, 2011

18

Chip-Package Interaction in 3D stacked IC packages using Finite Element Modelling

Vandevelde, Bart, Ivankovic, A., Debecker, B., Lofrano, M., Vanstreels, K., Guo, W., Cherman, V., Gonzalez, M., Van der Plas, G., De Wolf, I., Beyne, E., Tokei, Z.

Journal:

Microelectronics Reliability

Year:

2014

Language:

english

File:

PDF, 2.27 MB

english, 2014

19

[IEEE 2012 4th Electronic System-Integration Technology Conference (ESTC) - Amsterdam, Netherlands (2012.09.17-2012.09.20)] 2012 4th Electronic System-Integration Technology Conference - Early fatigue failures in copper wire bonds inside packages with low CTE green mold compounds

Vandevelde, Bart, Willems, Geert

Year:

2012

Language:

english

File:

PDF, 323 KB

english, 2012

20

Evaluation of Fatigue Behavior of Lead-Free Solder Joints in Four-Point Bending Test by Finite-Element Modeling

Sabuncuoglu, Baris, Vanhee, Filip, Willems, Geert, Vandevelde, Bart, Vandepitte, Dirk

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Year:

2017

Language:

english

File:

PDF, 1.79 MB

english, 2017

21

Brittle to Ductile Fracture Transition in Bulk Pb-Free Solders

Ratchev, Petar, Vandevelde, Bart, Verlinden, Bert, Allaert, Bart, Werkhoven, Daniel

Journal:

IEEE Transactions on Components and Packaging Technologies

Year:

2007

Language:

english

File:

PDF, 7.22 MB

english, 2007

22

[IEEE 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Budapest, Hungary (2015.4.19-2015.4.22)] 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems - Impact of solder-joint tilting on the reliability of LED-based PCB assemblies: A combined experimental and FEM analysis

Vandevelde, Bart, Zanon, Franco, Griffoni, Alessio, Li, Xiaolong, Willems, Geert, Meneghini, Matteo

Year:

2015

Language:

english

File:

PDF, 1.99 MB

english, 2015

23

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Electrical characterization, modeling and reliability analysis of a via last TSV

Majeed, Bivragh, Sabuncuoglu Tezcan, Deniz, Vandevelde, Bart, Duval, Fabrice, Soussan, Philippe, Beyne, Eric

Year:

2010

Language:

english

File:

PDF, 3.86 MB

english, 2010

24

[IEEE 2011 Materials for Advanced Metallization (MAM) - Dresden, Germany (2011.05.8-2011.05.12)] 2011 IEEE International Interconnect Technology Conference - 3D technology roadmap and status

Marchal, Paul, Van der Plas, Geert, Eneman, Geert, Moroz, Victor, Badaroglu, Mustafa, Mercha, Abdelkarim, Thijs, Steven, Linten, Dimitri, Guruprasad, Katti, Stucchi, Michele, Vandevelde, Bart, O'Prins

Year:

2011

Language:

english

File:

PDF, 1.12 MB

english, 2011

25

Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging

Andrej Ivankovic, Kris Vanstreels, Daniel Vanderstraeten, Guy Brizar, Renaud Gillon, Eddy Blansaer, Bart Vandevelde

Journal:

Microelectronics Reliability

Year:

2012

Language:

english

File:

PDF, 1.21 MB

english, 2012

26

Modeling and Control of Electrowetting Induced Droplet Motion

Oprins, Herman, Vandevelde, Bart, Baelmans, Martine

Journal:

Year:

2012

Language:

english

File:

PDF, 781 KB

english, 2012

27

[IEEE Technology (ICICDT) - Kaohsiung, Taiwan (2011.05.2-2011.05.4)] 2011 IEEE International Conference on IC Design & Technology - On the impact of the edge profile of interconnects on the occurrence of passivation cracks of plastic-encapsulated electronic power devices

Ackaert, Jan, Vanderstraeten, Daniel, Vandevelde, Bart

Year:

2011

Language:

english

File:

PDF, 1.29 MB

english, 2011

28

The Shear Test as Interface Characterization Tool Applied to the Si-BCB Interface

Degryse, Dominiek, Vandevelde, Bart, Beyne, Eric, Degrieck, Joris

Journal:

Journal of Electronic Packaging

Year:

2009

Language:

english

File:

PDF, 426 KB

english, 2009

29

[IEEE 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Dresden, Germany (2017.4.3-2017.4.5)] 2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - In-situ monitoring of field conditions and interconnect integrity for an electronic on-board module

Labie, Riet, Vandevelde, Bart, van Meensel, Wesley, Vogeleer, Mike, Werkhoven, Daniel, Allaert, Bart, Willems, Geert

Year:

2017

Language:

english

File:

PDF, 33.76 MB

english, 2017

30

Shaft speed ripples in wind turbines caused by tower shadow and wind shear

Van de Vyver, Jan, Vandoorn, Tine L., De Kooning, Jeroen D.M., Vandevelde, Lieven, Meersman, Bart

Journal:

IET Renewable Power Generation

Year:

2014

Language:

english

File:

PDF, 444 KB

english, 2014

31

Design and performance of metal conductors for stretchable electronic circuits

Gonzalez, Mario, Axisa, Fabrice, Bossuyt, Frederick, Hsu, Yung‐Yu, Vandevelde, Bart, Vanfleteren, Jan

Journal:

Year:

2009

Language:

english

File:

PDF, 567 KB

english, 2009

32

Four-point bending cycling: The alternative for thermal cycling solder fatigue testing of electronic components

Vandevelde, Bart, Vanhee, Filip, Pissoort, Davy, Degrendele, Lieven, De Baets, Johan, Allaert, Bart, Lauwaert, Ralph, Zanon, Franco, Labie, Riet, Willems, Geert

Journal:

Microelectronics Reliability

Year:

2017

Language:

english

File:

PDF, 1.13 MB

english, 2017

33

Thermal, mechanical and multi-physics simulation and experiments in micro-electronics and micro-systems

Artur Wymysłowski, Bart Vandevelde, Dag Andersson

Journal:

Microelectronics Reliability

Year:

2007

Language:

english

File:

PDF, 79 KB

english, 2007

34

Modified micro–macro thermo-mechanical modelling of ceramic ball grid array packages

Bart Vandevelde, Dominiek Degryse, Eric Beyne, Eric Roose, Dorina Corlatan, Guido Swaelen, Geert Willems, Filip Christiaens, Alcatel Bell, Dirk Vandepitte, Martine Baelmans

Journal:

Microelectronics Reliability

Year:

2003

Language:

english

File:

PDF, 891 KB

english, 2003

35

[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Impact of post-plating anneal and through-silicon via dimensions on Cu pumping

De Messemaeker, Joke, Pedreira, Olalla Varela, Vandevelde, Bart, Philipsen, Harold, De Wolf, Ingrid, Beyne, Eric, Croes, Kristof

Year:

2013

Language:

english

File:

PDF, 1.21 MB

english, 2013

36

[IEEE 2010 International Symposium on Power Electronics, Electrical Drives, Automation and Motion (SPEEDAM 2010) - Pisa, Italy (2010.06.14-2010.06.16)] SPEEDAM 2010 - Power quality improvements through power electronic interfaced distributed generation

Degroote, Lieven, Renders, Bert, Meersman, Bart, Vandoorn, Tine L., Vandevelde, Lieven

Year:

2010

Language:

english

File:

PDF, 144 KB

english, 2010

37

Comparison of calculation methods for smoke and heat evacuation for enclosure fires in large compartments

Merci, Bart, Vandevelde, Paul

Journal:

Thermal Science

Year:

2007

Language:

english

File:

PDF, 1.13 MB

english, 2007

38

[IEEE 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Hannover, Germany (2019.3.24-2019.3.27)] 2019 20th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) - Improved QFN thermal cycling reliability using low melting temperature SnBi based solder paste LMPA-Q

Vandevelde, Bart, Labie, Riet, Lauwaert, Ralph, Werkhoven, Daniel, Vanderstraeten, Daniel, Blansaer, Eddy, Lannoo, Jonas, Pissoort, Davy

Year:

2019

File:

PDF, 796 KB

2019

39

[IEEE 2006 8th Electronics Packaging Technology Conference - Singapore (2006.12.6-2006.12.8)] 2006 8th Electronics Packaging Technology Conference - Enabling SPICE-type modeling of the thermal properties of 3D-stacked ICs

Chen, Liu, Vandevelde, Bart, Swinnen, Bart, Beyne, Eric

Year:

2006

Language:

english

File:

PDF, 453 KB

english, 2006

40

[IEEE 2009 IEEE 59th Electronic Components and Technology Conference (ECTC 2009) - San Diego, CA, USA (2009.05.26-2009.05.29)] 2009 59th Electronic Components and Technology Conference - An integrated creep, crack growth and thermo-mechanical fatigue model for WLCSP assemblies soldered with SAC 405

Limaye, Paresh, Vandevelde, Bart, Vandepitte, Dirk, Verlinden, Bert

Year:

2009

Language:

english

File:

PDF, 1.57 MB

english, 2009

41

Voltage-Based Control of a Smart Transformer in a Microgrid

Vandoorn, Tine L., De Kooning, Jeroen D. M., Meersman, Bart, Guerrero, Josep M., Vandevelde, Lieven

Journal:

IEEE Transactions on Industrial Electronics

Year:

2013

Language:

english

File:

PDF, 482 KB

english, 2013

42

[IEEE 2007 9th Electronics Packaging Technology Conference - Singapore (2007.12.10-2007.12.12)] 2007 9th Electronics Packaging Technology Conference - Low-Temperature Embrittlement of Lead-Free Solders in Joint Level Impact Testing

Limaye, Paresh, Maurissen, Wout, Lambrinou, Konstantina, Duflos, Frederic, Vandevelde, Bart, Allaert, Bart, Hillaert, Joost, Vandepitte, Dirk, Verlinden, Bert

Year:

2007

Language:

english

File:

PDF, 3.49 MB

english, 2007

43

Influence of annealing conditions on the mechanical and microstructural behavior of electroplated Cu-TSV

Okoro, Chukwudi, Vanstreels, Kris, Labie, Riet, Lühn, Ole, Vandevelde, Bart, Verlinden, Bert, Vandepitte, Dirk

Journal:

Journal of Micromechanics and Microengineering

Year:

2010

Language:

english

File:

PDF, 1.09 MB

english, 2010

44

[IEEE 2012 IEEE/PES Transmission and Distribution Conference and Exposition (T&D) - Orlando, FL, USA (2012.05.7-2012.05.10)] PES T&D 2012 - Communication-based secondary control in microgrids with voltage-based droop control

Vandoorn, Tine L., De Kooning, Jeroen D.M., Meersman, Bart, Vandevelde, Lieven

Year:

2012

Language:

english

File:

PDF, 356 KB

english, 2012

45

[IEEE 2013 IEEE Power & Energy Society General Meeting - Vancouver, BC (2013.7.21-2013.7.25)] 2013 IEEE Power & Energy Society General Meeting - Solar Commercial Virtual Power Plant

Zwaenepoel, Brecht, Laveyne, Joannes I., Vandevelde, Lieven, Vandoorn, Tine L., Meersman, Bart, Van Eetvelde, Greet

Year:

2013

Language:

english

File:

PDF, 240 KB

english, 2013

46

AIP Conference Proceedings [AIP STRESS-INDUCED PHENOMENA IN METALLIZATION: 11th International Workshop - Bad Schandau, (Germany) (12–14 April 2010)] - Elimination Of The Axial Deformation Problem Of Cu-TSV In 3D Integration

Okoro, Chukwudi, Huyghebaert, Cedric, Van Olmen, Jan, Labie, Riet, Lambrinou, Konstantza, Vandevelde, Bart, Beyne, Eric, Vandepitte, Dirk, Zschech, Ehrenfried, Ogawa, Shinichi, Ho, Paul S.

Year:

2010

Language:

english

File:

PDF, 2.12 MB

english, 2010

47

[IEEE 2010 IEEE International Reliability Physics Symposium - Garden Grove (Anaheim), CA, USA (2010.05.2-2010.05.6)] 2010 IEEE International Reliability Physics Symposium - Degradation and failure analysis of copper and tungsten contacts under high fluence stress

Kauerauf, Thomas, Butera, Geni, Croes, Kristof, Demuynck, Steven, Wilson, Christopher J., Roussel, Philippe, Drijbooms, Chris, Bender, Hugo, Lofrano, Melina, Vandevelde, Bart, Tokei, Zsolt, Groeseneke

Year:

2010

Language:

english

File:

PDF, 3.17 MB

english, 2010

48

[IEEE 2016 XXII International Conference on Electrical Machines (ICEM) - Lausanne, Switzerland (2016.9.4-2016.9.7)] 2016 XXII International Conference on Electrical Machines (ICEM) - Maximum efficiency current waveforms for a PMSM including iron losses and armature reaction

De Kooning, Jeroen D. M., Van de Vyver, Jan, Meersman, Bart, Vandevelde, Lieven

Year:

2016

Language:

english

File:

PDF, 354 KB

english, 2016

49

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Insertion bonding: A novel Cu-Cu bonding approach for 3D integration

Okoro, Chukwudi, Agarwal, Rahul, Limaye, Paresh, Vandevelde, Bart, Vandepitte, Dirk, Beyne, Eric

Year:

2010

Language:

english

File:

PDF, 1.80 MB

english, 2010

50

[IEEE 2010 14th International Conference on Harmonics and Quality of Power (ICHQP) - Bergamo, Italy (2010.09.26-2010.09.29)] Proceedings of 14th International Conference on Harmonics and Quality of Power - ICHQP 2010 - Influence of bus voltage variations on two Maximum Power Point control loops

Martens, Koen, Meersman, Bart, De Kooning, Jeroen, Renders, Bert, Vandoorn, Tine, Vandevelde, Lieven

Year:

2010

Language:

english

File:

PDF, 1.12 MB

english, 2010

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